BGA 162 Isp Pinout | Bga 162 Isp Test Point

bga 162 isp pinout

BGA 162 Isp Pinout | Bga 162 Isp Test Point Each BGA chip is identified by the number of PIN it contains a BGA 162 would have place on 162 PIN’s on PCB surface. In addition, a BGA can have different form factor variants. SMD ball grid array, BGA packages enable high density connections to … Read more

BGA 221 Isp Pinout | Bga 221 Isp Test Point

bga 221 isp pinout

BGA 221 Isp Pinout | Bga 221 Isp Test Point Each BGA chip is identified by the number of PIN it contains a BGA 221 would have place on 221 PIN’s on PCB surface. In addition, a BGA can have different form factor variants. SMD ball grid array, BGA packages enable high density connections to … Read more

BGA 254 Isp Pinout | BGA 254 Isp Test Point

BGA 254 Isp Pinout | BGA 254 Isp Test Point Each BGA chip is identified by the number of PIN it contains a BGA 254 would have place on 254 PIN’s on PCB surface. In addition, a BGA can have different form factor variants. SMD ball grid array, BGA packages enable high density connections to … Read more

What is BGA (Ball Grid Array)

emmc bga datasheet

What is BGA (Ball Grid Array) BGA components are packaged electronically into standardized packages that include a wide array of shapes and sizes. It is well-known for its minimal inductance, high lead count and remarkably effective density. Ball grid array (BGA) is a type of surface mount technology (SMT) that is used for packaging integrated … Read more

BGA 153 Isp Pinout | Bga 153 Test Point

BGA 153 Isp Pinout | Bga 153 Test Point Each BGA chip is identified by the number of PIN it contains a BGA 153 would have place on 153 PIN’s on PCB surface. In addition, a BGA can have different form factor variants. SMD ball grid array, BGA packages enable high density connections to be … Read more

What is ISP Pinout | In-System Programming

What is ISP Pinout ? ISP means “In-System Programming”.In-System Programming (ISP) allows communication to take place with a target chip without the need to remove it. The main advantage of this method is the possibility to communicate with a target chip eMMC or eMCP bypassing the CPU. It brings higher speed for data extraction compared … Read more

Z3X Easy JTAG Plus

easy jtag plus

In this post, we are giving complete information about the Easy JTAG Plus Box. Z3X Easy Jtag Plus is an innovative all in one service tool for phone and phone boot repair, data recovery, SPI memory programming and many other features. Supports eMMC, ISP, JTAG, SPI, NAND and much more protocols. What is Z3X Easy … Read more

UFI Box

UFI Box UFi Box is a powerful EMMC service tool. Box can read EMMC user data, as well as repair, resize, format, erase, read/write and update the EMMC firmware on Samsung, China phone SK Hynix, Toshiba, Kingston, Micron and other brands *. UFi Box – Features: Repair EMMC Resize EMMC Format EMMC Write full data, fully erase Read … Read more

Medusa Pro II | Medusa Pro 2

Medusa Pro II / Medusa Pro 2 Medusa PRO II Box is a brand new version of the professional phone servicing tool intended for a wide range of Samsung, Huawei, LG, Lenovo, Motorola, Oppo, Sony, Xiaomi, ZTE and other devices through USB, UFS and MMC interfaces. The main intended purpose of Medusa PRO II Box is repairing dead boots of the devices (mobile phones, PDAs, modems, etc.) or these … Read more

HypoBox eMMc Tool

HypoBox eMMc Tool Hypobox is a professional engineering tool intended for programming flash memory (UFS, NAND, PCIe, eMMC, eMCP). DT Pro Tool is a solution allowing you to downgrade OS version and repair Huawei and Xiaomi phones. HW Tool allows you to flash and bypass FRP and Huawei ID on Huawei phones. Supported Memory Standards: Universal Flash Storage … Read more